Selbmann, F.; Paul, S.D.; Satwara, M.; Roscher, F.; Wiemer, M.; Kuhn, H.; Joseph, Y.
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates. Micromachines 2023, 14, 415.
https://doi.org/10.3390/mi14020415
AMA Style
Selbmann F, Paul SD, Satwara M, Roscher F, Wiemer M, Kuhn H, Joseph Y.
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates. Micromachines. 2023; 14(2):415.
https://doi.org/10.3390/mi14020415
Chicago/Turabian Style
Selbmann, Franz, Soumya Deep Paul, Maulik Satwara, Frank Roscher, Maik Wiemer, Harald Kuhn, and Yvonne Joseph.
2023. "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates" Micromachines 14, no. 2: 415.
https://doi.org/10.3390/mi14020415
APA Style
Selbmann, F., Paul, S. D., Satwara, M., Roscher, F., Wiemer, M., Kuhn, H., & Joseph, Y.
(2023). Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates. Micromachines, 14(2), 415.
https://doi.org/10.3390/mi14020415
