Kim, T.; Han, S.; Lee, J.; Na, Y.; Jung, J.; Park, Y.C.; Oh, J.; Yang, C.; Kim, H.Y.
Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter. Micromachines 2023, 14, 448.
https://doi.org/10.3390/mi14020448
AMA Style
Kim T, Han S, Lee J, Na Y, Jung J, Park YC, Oh J, Yang C, Kim HY.
Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter. Micromachines. 2023; 14(2):448.
https://doi.org/10.3390/mi14020448
Chicago/Turabian Style
Kim, Taehyun, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang, and Hee Yeoun Kim.
2023. "Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter" Micromachines 14, no. 2: 448.
https://doi.org/10.3390/mi14020448
APA Style
Kim, T., Han, S., Lee, J., Na, Y., Jung, J., Park, Y. C., Oh, J., Yang, C., & Kim, H. Y.
(2023). Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter. Micromachines, 14(2), 448.
https://doi.org/10.3390/mi14020448