Wen, X.; Chen, J.; Liu, R.; He, C.; Huang, Q.; Guo, H.
Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses. Micromachines 2024, 15, 1177.
https://doi.org/10.3390/mi15101177
AMA Style
Wen X, Chen J, Liu R, He C, Huang Q, Guo H.
Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses. Micromachines. 2024; 15(10):1177.
https://doi.org/10.3390/mi15101177
Chicago/Turabian Style
Wen, Xiao, Jinchuan Chen, Ruiwen Liu, Chunhua He, Qinwen Huang, and Huihui Guo.
2024. "Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses" Micromachines 15, no. 10: 1177.
https://doi.org/10.3390/mi15101177
APA Style
Wen, X., Chen, J., Liu, R., He, C., Huang, Q., & Guo, H.
(2024). Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses. Micromachines, 15(10), 1177.
https://doi.org/10.3390/mi15101177