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Journal: Micromachines, 2018
Volume: 9
Number: 519

Article: Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication
Authors: by Kangmin Leng, Chuanfei Guo, Kang Wu and Zhigang Wu
Link: https://www.mdpi.com/2072-666X/9/10/519

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