Article Versions Notes

Xing Z, Ke H, Wang X, Zheng T, Qiao Y, Chen K, Zhang X, Zhang L, Bai C, Li Z. Investigation of the Thermal Conductivity of Resin-Based Lightweight Composites Filled with Hollow Glass Microspheres. Polymers. 2020; 12(3):518. https://doi.org/10.3390/polym12030518

Xing, Zhipeng, Hongjun Ke, Xiaodong Wang, Ting Zheng, Yingjie Qiao, Kaixuan Chen, Xiaohong Zhang, Lili Zhang, Chengying Bai, and Zhuoran Li. 2020. "Investigation of the Thermal Conductivity of Resin-Based Lightweight Composites Filled with Hollow Glass Microspheres" Polymers 12, no. 3: 518. https://doi.org/10.3390/polym12030518

Xing, Z., Ke, H., Wang, X., Zheng, T., Qiao, Y., Chen, K., Zhang, X., Zhang, L., Bai, C., & Li, Z. (2020). Investigation of the Thermal Conductivity of Resin-Based Lightweight Composites Filled with Hollow Glass Microspheres. Polymers, 12(3), 518. https://doi.org/10.3390/polym12030518