Li, Y.; Fu, G.; Wan, B.; Jiang, M.; Zhang, W.; Yan, X.
Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature. Appl. Sci. 2020, 10, 1951.
https://doi.org/10.3390/app10061951
AMA Style
Li Y, Fu G, Wan B, Jiang M, Zhang W, Yan X.
Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature. Applied Sciences. 2020; 10(6):1951.
https://doi.org/10.3390/app10061951
Chicago/Turabian Style
Li, Yanruoyue, Guicui Fu, Bo Wan, Maogong Jiang, Weifang Zhang, and Xiaojun Yan.
2020. "Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature" Applied Sciences 10, no. 6: 1951.
https://doi.org/10.3390/app10061951
APA Style
Li, Y., Fu, G., Wan, B., Jiang, M., Zhang, W., & Yan, X.
(2020). Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature. Applied Sciences, 10(6), 1951.
https://doi.org/10.3390/app10061951