Foreword to the Special Issue on Terahertz Nondestructive Testing
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Conflicts of Interest
References
- Ellrich, F.; Bauer, M.; Schreiner, N.; Keil, A.; Pfeiffer, T.; Klier, J.; Weber, S.; Jonuscheit, J.; Friederich, F.; Molter, D. Terahertz quality inspection for automotive and aviation industries. J. Infrared Millim. Terahertz Waves 2020, 41, 470–489. [Google Scholar] [CrossRef] [Green Version]
- Jonuscheit, J. Terahertz Waves for Thickness Analyses: Non-destructive component analysis using terahertz time domain spectroscopy. Opt. Photonik 2016, 11, 30–33. [Google Scholar] [CrossRef]
- Weber, S.; Liebelt, L.; Klier, J.; Pfeiffer, T.; Molter, D.; Ellrich, F.; Jonuscheit, J.; Von Freymann, G. Influence of system performance on layer thickness determination using terahertz time-domain spectroscopy. J. Infrared Millim. Terahertz Waves 2020, 41, 438–449. [Google Scholar] [CrossRef] [Green Version]
- Whelan, P.R.; Shen, Q.; Luo, D.; Wang, M.; Ruoff, R.S.; Jepsen, P.U.; Bøggild, P.; Zhou, B. Reference-free THz-TDS conductivity analysis of thin conducting films. Opt. Express 2020, 28, 28819–28830. [Google Scholar] [CrossRef] [PubMed]
- Tao, Y.H.; Fitzgerald, A.J.; Wallace, V.P. Non-contact, non-destructive testing in various industrial sectors with terahertz technology. Sensors 2020, 20, 712. [Google Scholar] [CrossRef] [PubMed] [Green Version]
- Lee, E.S.; Moon, K.; Lee, I.M.; Kim, H.S.; Park, D.W.; Park, J.W.; Lee, D.H.; Han, S.P.; Kim, N.; Park, K.H. Semiconductor-based terahertz photonics for industrial applications. J. Lightwave Technol. 2017, 36, 274–283. [Google Scholar] [CrossRef]
- Naftaly, M.; Vieweg, N.; Deninger, A. Industrial applications of terahertz sensing: State of play. Sensors 2019, 19, 4203. [Google Scholar] [CrossRef] [PubMed] [Green Version]
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Smith, R.A. Foreword to the Special Issue on Terahertz Nondestructive Testing. Appl. Sci. 2021, 11, 11724. https://doi.org/10.3390/app112411724
Smith RA. Foreword to the Special Issue on Terahertz Nondestructive Testing. Applied Sciences. 2021; 11(24):11724. https://doi.org/10.3390/app112411724
Chicago/Turabian StyleSmith, Robert A. 2021. "Foreword to the Special Issue on Terahertz Nondestructive Testing" Applied Sciences 11, no. 24: 11724. https://doi.org/10.3390/app112411724
APA StyleSmith, R. A. (2021). Foreword to the Special Issue on Terahertz Nondestructive Testing. Applied Sciences, 11(24), 11724. https://doi.org/10.3390/app112411724