Liu, C.-L.; Tseng, C.-J.; Hsaio, W.-H.; Wu, S.-H.; Lu, S.-R.
Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network. Appl. Sci. 2022, 12, 11478.
https://doi.org/10.3390/app122211478
AMA Style
Liu C-L, Tseng C-J, Hsaio W-H, Wu S-H, Lu S-R.
Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network. Applied Sciences. 2022; 12(22):11478.
https://doi.org/10.3390/app122211478
Chicago/Turabian Style
Liu, Chien-Liang, Chun-Jan Tseng, Wen-Hoar Hsaio, Sheng-Hao Wu, and Shu-Rong Lu.
2022. "Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network" Applied Sciences 12, no. 22: 11478.
https://doi.org/10.3390/app122211478
APA Style
Liu, C. -L., Tseng, C. -J., Hsaio, W. -H., Wu, S. -H., & Lu, S. -R.
(2022). Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network. Applied Sciences, 12(22), 11478.
https://doi.org/10.3390/app122211478