Zhou, L.; Yang, D.; Chen, L.; Zhuang, W.; Zhang, S.; Xiong, Y.
A Review of Test Stimulus Compression Methods for Ultra-Large-Scale Integrated Circuits. Appl. Sci. 2024, 14, 10769.
https://doi.org/10.3390/app142310769
AMA Style
Zhou L, Yang D, Chen L, Zhuang W, Zhang S, Xiong Y.
A Review of Test Stimulus Compression Methods for Ultra-Large-Scale Integrated Circuits. Applied Sciences. 2024; 14(23):10769.
https://doi.org/10.3390/app142310769
Chicago/Turabian Style
Zhou, Liang, Daming Yang, Lei Chen, Wei Zhuang, Shiyuan Zhang, and Yuanyuan Xiong.
2024. "A Review of Test Stimulus Compression Methods for Ultra-Large-Scale Integrated Circuits" Applied Sciences 14, no. 23: 10769.
https://doi.org/10.3390/app142310769
APA Style
Zhou, L., Yang, D., Chen, L., Zhuang, W., Zhang, S., & Xiong, Y.
(2024). A Review of Test Stimulus Compression Methods for Ultra-Large-Scale Integrated Circuits. Applied Sciences, 14(23), 10769.
https://doi.org/10.3390/app142310769