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Li Y, Meng W, Shi H, Gao Z, Zhang K, Li G, Wang B. A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment. Applied Sciences. 2019; 9(19):3950. https://doi.org/10.3390/app9193950

Li, Yupeng, Weiying Meng, Huaitao Shi, Zhijun Gao, Ke Zhang, Guochang Li, and Bing Wang. 2019. "A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment" Applied Sciences 9, no. 19: 3950. https://doi.org/10.3390/app9193950

Li, Y., Meng, W., Shi, H., Gao, Z., Zhang, K., Li, G., & Wang, B. (2019). A Cost-Effective Solution to Improving the Electrical Performance of Metal Contacting Interfaces in IC System under Temperature-Humidity Environment. Applied Sciences, 9(19), 3950. https://doi.org/10.3390/app9193950