Article Versions Notes

Chen S, Wang X, Guo Z, Wu C, Liu Y, Liu Y, Su X. Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys. Coatings. 2023; 13(2):285. https://doi.org/10.3390/coatings13020285

Chen, Sheng, Xinbao Wang, Zhiqiu Guo, Changjun Wu, Yongxiong Liu, Ya Liu, and Xuping Su. 2023. "Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys" Coatings 13, no. 2: 285. https://doi.org/10.3390/coatings13020285

Chen, S., Wang, X., Guo, Z., Wu, C., Liu, Y., Liu, Y., & Su, X. (2023). Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys. Coatings, 13(2), 285. https://doi.org/10.3390/coatings13020285