Luo, D.; Chen, M.; Lai, W.; Xia, H.; Ding, X.; Deng, Z.
A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement. Electronics 2021, 10, 194.
https://doi.org/10.3390/electronics10020194
AMA Style
Luo D, Chen M, Lai W, Xia H, Ding X, Deng Z.
A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement. Electronics. 2021; 10(2):194.
https://doi.org/10.3390/electronics10020194
Chicago/Turabian Style
Luo, Dan, Minyou Chen, Wei Lai, Hongjian Xia, Xueni Ding, and Zhenyu Deng.
2021. "A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement" Electronics 10, no. 2: 194.
https://doi.org/10.3390/electronics10020194
APA Style
Luo, D., Chen, M., Lai, W., Xia, H., Ding, X., & Deng, Z.
(2021). A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement. Electronics, 10(2), 194.
https://doi.org/10.3390/electronics10020194