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Journal: Electronics, 2021
Volume: 10
Number: 194

Article: A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement
Authors: by Dan Luo, Minyou Chen, Wei Lai, Hongjian Xia, Xueni Ding and Zhenyu Deng
Link: https://www.mdpi.com/2079-9292/10/2/194

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