Li, B.; Wan, G.; Li, Y.; Shao, Z.; Chen, G.; Ren, F.; Su, J.
Space-Borne System-in-Package Based on High Reliability Microwave Interconnections. Electronics 2023, 12, 1122.
https://doi.org/10.3390/electronics12051122
AMA Style
Li B, Wan G, Li Y, Shao Z, Chen G, Ren F, Su J.
Space-Borne System-in-Package Based on High Reliability Microwave Interconnections. Electronics. 2023; 12(5):1122.
https://doi.org/10.3390/electronics12051122
Chicago/Turabian Style
Li, Bin, Guobin Wan, Yun Li, Zhaoshen Shao, Guowei Chen, Fengchao Ren, and Jiaqi Su.
2023. "Space-Borne System-in-Package Based on High Reliability Microwave Interconnections" Electronics 12, no. 5: 1122.
https://doi.org/10.3390/electronics12051122
APA Style
Li, B., Wan, G., Li, Y., Shao, Z., Chen, G., Ren, F., & Su, J.
(2023). Space-Borne System-in-Package Based on High Reliability Microwave Interconnections. Electronics, 12(5), 1122.
https://doi.org/10.3390/electronics12051122