Nguyen, M.-H.; Onken, A.; Wulff, A.; Foremny, K.; Torgau, P.; Schütte, H.; Hild, S.; Doll, T.
Computational Modeling of Diffusion-Based Delamination for Active Implantable Medical Devices. Bioengineering 2023, 10, 625.
https://doi.org/10.3390/bioengineering10050625
AMA Style
Nguyen M-H, Onken A, Wulff A, Foremny K, Torgau P, Schütte H, Hild S, Doll T.
Computational Modeling of Diffusion-Based Delamination for Active Implantable Medical Devices. Bioengineering. 2023; 10(5):625.
https://doi.org/10.3390/bioengineering10050625
Chicago/Turabian Style
Nguyen, Minh-Hai, Adrian Onken, Anika Wulff, Katharina Foremny, Patricia Torgau, Helmut Schütte, Sabine Hild, and Theodor Doll.
2023. "Computational Modeling of Diffusion-Based Delamination for Active Implantable Medical Devices" Bioengineering 10, no. 5: 625.
https://doi.org/10.3390/bioengineering10050625
APA Style
Nguyen, M. -H., Onken, A., Wulff, A., Foremny, K., Torgau, P., Schütte, H., Hild, S., & Doll, T.
(2023). Computational Modeling of Diffusion-Based Delamination for Active Implantable Medical Devices. Bioengineering, 10(5), 625.
https://doi.org/10.3390/bioengineering10050625