Kulkarni, R.; Wappler, P.; Soltani, M.; Haybat, M.; Guenther, T.; Groezinger, T.; Zimmermann, A.
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. J. Manuf. Mater. Process. 2019, 3, 18.
https://doi.org/10.3390/jmmp3010018
AMA Style
Kulkarni R, Wappler P, Soltani M, Haybat M, Guenther T, Groezinger T, Zimmermann A.
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. Journal of Manufacturing and Materials Processing. 2019; 3(1):18.
https://doi.org/10.3390/jmmp3010018
Chicago/Turabian Style
Kulkarni, Romit, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, and André Zimmermann.
2019. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages" Journal of Manufacturing and Materials Processing 3, no. 1: 18.
https://doi.org/10.3390/jmmp3010018
APA Style
Kulkarni, R., Wappler, P., Soltani, M., Haybat, M., Guenther, T., Groezinger, T., & Zimmermann, A.
(2019). An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages. Journal of Manufacturing and Materials Processing, 3(1), 18.
https://doi.org/10.3390/jmmp3010018