Additive Manufacturing of Metals II

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Additive Manufacturing".

Deadline for manuscript submissions: closed (30 June 2022) | Viewed by 484

Special Issue Editor


E-Mail Website
Guest Editor

Special Issue Information

Dear Colleagues,

Metals Additive Manufacturing (AM) is a rapidly growing manufacturing capability. The cumulative annual growth of AM is predicted to exceed 20% CAGR for many years to come, reaching USD 9 billion in 2017 and expected to rise to over USD 63 billion by 2025. The metals (AM) market is particularly buoyant, rising 41% CAGR over 2010–2014. Current metal AM service market is GBP 100 m, projected to reach GBP 590 million by 2020 (CAGR of 31.5%), with increasing application in the aerospace and defense industry. Despite this remarkable rate of growth, there are significant challenges that are limiting the wider uptake and exploitation of metals AM, spanning across the entire metal AM supply chain. These include a lack of AM design and modelling skills and software, a gap in understanding in properties obtained from different machines and technologies, and an incomplete understanding of the causes of part quality variation and their effect on part failure.

For this Special Issue in Metals, we welcome reviews and articles in the areas of material supply, part design, process modelling, process technology, post-processing techniques and applications of metals AM.

Prof. Dr. Gregory John Gibbons
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Metals additive manufacturing
  • Metal powders
  • Metallurgy
  • Design
  • Manufacturing
  • Thermal modelling
  • Mechanical modelling
  • Powder bed fusion
  • Directed energy deposition
  • Binder jetting

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Related Special Issue

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop