Selected Papers from the 20th EuroSimE Conference
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (1 October 2019) | Viewed by 448
Special Issue Editors
Interests: reliability; systems; integration; virtual prototyping; statistics; health monitoring
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Special Issue Information
Dear Colleagues,
On behalf of the Editorial Board, we are pleased to propose a selection of papers presented at the 20th IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EurosimE 2019) held in the city of Hannover, Germany, on 24–27 March, 2019 (www.eurosime.org). EuroSimE was created as the only annual international conference with a focus on thermal, mechanical and multiphysical simulations and experiments for microelectronics and microsystems. The first conference was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of microelectronics and microsystems. Since then, EuroSimE has garnered worldwide attention with participants from more than 30 countries, spanning all continents, and has become a fully sponsored IEEE CPMT technical event. The EuroSimE conference has earned a reputation for high scientific and technical quality. We hope that this Special Issue will be helpful to your work. We also welcome your feedback and suggestions for improving our work, with the aim of providing you with valuable references in the future. We would also like to sincerely thank the journal Micromachines for its editorial support and constant assistance throughout the preparation of this issue.
Prof. Willem Dirk van Driel
Prof. Christopher Bailey
Guest Editors
Manuscript Submission Information
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Keywords
- nano-electronic mechanical devices
- microfluidics
- multiphysics simulation
- fluid structure interactions
- integrated process modelling
- additive manufacturing, MEMS sensors and actuators
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