Advanced Technologies in Heterogeneous Integration
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: closed (31 July 2024) | Viewed by 303
Special Issue Editors
Interests: heterogeneous integration of microsystem; 2D/3D integration; integrated circuit packaging; advanced packaging materials; phosphor conversion material; nano metal joining and interconnection; LED/LD packaging; power electronic packaging
Interests: LED/LD packaging; high-power white LED/LDs; UV-LEDs; power devices; opto-thermal performances; phosphor-in-glasses; 2D/3D ceramic substrates; LED applications
Special Issues, Collections and Topics in MDPI journals
Interests: manufacturing process; packaging and testing technology of high-speed microwave integrated devices; heterogeneous integration of microsystems; integrated circuits
Special Issue Information
Dear Colleagues,
Integration technologies, such as integrated circuits, power electronics, microwave electronics, optoelectronics, etc., are widely applied in daily life and the aerospace, healthcare, weaponry, and industry fields. Heterogeneous integration is essential for developing miniaturized, highly efficient, deeply integrated, low-level-power-consuming, and low-cost electronic systems. In order to enhance their performances and reliability, advanced integration materials, designs, technologies, and equipment, and evaluation methods have been proposed, developed, and optimized via theoretical analysis, scheme design, computational simulation, and experimental exploration.
This Special Issue seeks to showcase research papers and review articles discussing the recent developments and applications of advanced heterogeneous integration. Areas of interest include, but are not limited to:
- Integration design and simulation (molecular dynamics, thermomechanical coupling, etc.);
- New integration materials (SiC, GaN, diamond, AlN, Ga2O3, etc.);
- Advanced integration technologies (via hole filling; bonding and interconnection);
- Integration equipment manufacturing;
- Integration performances and reliability;
- Testing and evaluation methods;
- New applications (wide bandgap semiconductors, 2D/3D integration, optoelectronics, etc.)
Dr. Yun Mou
Dr. Yang Peng
Prof. Dr. Jianming Xu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- heterogeneous integration
- semiconductors
- power electronics
- optoelectronics
- micro electro mechanical system (MEMS)
- 2D/3D integration
- design simulation
- performances
- reliability
- applications
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Related Special Issue
- Advanced Technologies in Electronic Packaging in Micromachines (10 articles)
