Bio-Based Polymer Adhesives and Materials
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Biobased and Biodegradable Polymers".
Deadline for manuscript submissions: closed (30 April 2024) | Viewed by 409
Special Issue Editors
Interests: wood; wood composites; wood panels; wood modification; bio-based materials
Special Issues, Collections and Topics in MDPI journals
Interests: wood adhesives; resins; bio-based materials; wood panels
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Adhesives play an important role in the wood industry. Formaldehyde-based resin adhesives are still the main ones for the preparation of wood panels for their good mechanical properties and low cost. They are also known for their unsustainability and potential hazards to human beings. Therefore, the development of adhesives based on natural and renewable materials has attracted an increasing amount of interest in recent decades, with some adhesives seeing significant success in industry, such as tannin- and soy-protein-based adhesives. However, many disadvantages over synthetic wood adhesives have been reported, for example, low mechanical strength, low flexibility, poor water resistance, too high viscosity, etc.
This Special Issue, entitled “Bio-Based Adhesives and Materials”, aims to present updated knowledge relating to adhesives and composites using renewable resources or materials, to report on progress in the enhancement of bio-based adhesives’ and materials’ mechanical properties by means of different treatments, to review the development of bio-based adhesives and materials, to demonstrate the relationships between the structure and the mechanical performances, and to report novel bio-based wood adhesives and materials. In particular, scientific contributions on bio-based adhesives for wood bonding and wood-based materials are expected. Reports on adhesives and materials for other applications are also welcomed.
Dr. Zhigang Wu
Prof. Dr. Hong Lei
Guest Editors
Manuscript Submission Information
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