Temperature Dependence of Interfacial Bonding and Configuration Transition in Graphene/Hexagonal Boron Nitride Containing Grain Boundaries and Functional Groups
Abstract
:1. Introduction
2. Results and Discussion
2.1. Validation
2.2. Coupling Effect of GBs and FGs at High Temperature
2.3. Coupling Effect of GBs and FGs at Different Strain
2.4. Interfacial Distance Effect
2.5. Stress Distribution and Configuration Transition
3. Materials and Methods
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
Abbreviations
Gr | graphene |
h-BN | hexagonal boron nitride |
G-BN | graphene/boron nitride heterostructures |
G-BN-GB | graphene/h-BN with grain boundaries |
G-BN-GO | graphene/h-BN with functional groups |
FGo | functional groups |
GBs | grain boundary |
GrO-BN-GBs | graphene/h-BN with FGo and GBs |
MD | molecular dynamics |
–O | epoxy |
–OH | hydroxyl |
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Various Types | Assessment Method (Potential) | Failure Strain | Failure Strength (GPa) | Young’s Modulus (GPa) | References |
---|---|---|---|---|---|
Single-layer | MD (Tersoff) | 0.204 | 123 | 919 | Present study |
Single-layer | MD (Tersoff) | 0.201 | 131 | 930 | Eshkalak et al. [28] |
Single-layer | MD (Tersoff) | 0.208 | 127 | 925 | Fan et al. [33] |
Experimental | 0.130 | 90 | 1000 | Zhao et al. [31] |
Various Types | Assessment Method (Potential) | Failure Strain | Failure Strength (GPa) | Young’s Modulus (GPa) | References |
---|---|---|---|---|---|
Single-layer | MD (Tersoff) | 0.207 | 125 | 921 | Present study |
Single-layer | MD (Tersoff) | 0.200 | 131 | 930 | Eshkalak et al. [28] |
Single-layer | MD (Tersoff) | 0.210 | 128 | 923 | Fan et al. [33] |
Experimental | - | - | 881 | Bosak et al. [32] |
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Fan, L.; Yao, W. Temperature Dependence of Interfacial Bonding and Configuration Transition in Graphene/Hexagonal Boron Nitride Containing Grain Boundaries and Functional Groups. Int. J. Mol. Sci. 2022, 23, 1433. https://doi.org/10.3390/ijms23031433
Fan L, Yao W. Temperature Dependence of Interfacial Bonding and Configuration Transition in Graphene/Hexagonal Boron Nitride Containing Grain Boundaries and Functional Groups. International Journal of Molecular Sciences. 2022; 23(3):1433. https://doi.org/10.3390/ijms23031433
Chicago/Turabian StyleFan, Lei, and Wenjuan Yao. 2022. "Temperature Dependence of Interfacial Bonding and Configuration Transition in Graphene/Hexagonal Boron Nitride Containing Grain Boundaries and Functional Groups" International Journal of Molecular Sciences 23, no. 3: 1433. https://doi.org/10.3390/ijms23031433
APA StyleFan, L., & Yao, W. (2022). Temperature Dependence of Interfacial Bonding and Configuration Transition in Graphene/Hexagonal Boron Nitride Containing Grain Boundaries and Functional Groups. International Journal of Molecular Sciences, 23(3), 1433. https://doi.org/10.3390/ijms23031433