Encapsulation of Electron Beam Melting Produced Alloy 718 to Reduce Surface Connected Defects by Hot Isostatic Pressing
Abstract
:1. Introduction
2. Materials and Methods
2.1. EBM Processing
2.2. Encapsulation Concept
2.3. Hot Isostatic Pressing
2.4. Metallographic Preparation and Characterization
3. Results and Discussion
3.1. Uncoated Condition
3.2. Coated Condition
4. Summary and Conclusions
- The hypothesis that encapsulation of EBM specimens through coatings can eliminate surface-connected defects during subsequent HIPing presents a novel idea. However, it could only be partly tested in this paper due to (a) very large surface roughness of the as-built EBM 718 specimen used for this study and (b) only two sides of the as-built specimen being coated.
- Few of the surface-connected defects were closed after subjecting the coated EBM-built specimen to HIPing. However, some of the lack of fusion defects and gaps at the EBM specimen-coating interface remained after HIPing.
- The presence of defects in the coated and HIPed specimen was rationalized as follows: the high surface roughness of the as-built specimens caused only partial “sealing” of defects, as gaps were observed between the EBM specimen and the coating. In addition, the through-thickness cracks resulting during coating on very rough substrate surfaces could have also connected the defects to the surface, despite the application of coating.
- The specimens were coated on only the two larger faces, leaving the remaining sides uncoated. This could have provided an additional path for HIP process gas infiltration from the uncoated sides.
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
Data Availability
References
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Element | Ni | C | Cr | Mo | Ti | Al | Fe | Nb | Ta |
---|---|---|---|---|---|---|---|---|---|
Wt % | 54.10 | 0.03 | 19.00 | 2.90 | 1.00 | 0.50 | Bal. | 4.90 | <0.01 |
Element | Ni | C | Cr | Mo | Ti | Al | Fe | Nb + Ta |
---|---|---|---|---|---|---|---|---|
Wt % | 50.00–55.00 | 0.02–0.08 | 17.00–21.00 | 2.80–3.30 | 0.70–1.10 | 0.03–0.70 | 15.00–21.00 | 4.70–5.50 |
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Zafer, Y.E.; Goel, S.; Ganvir, A.; Jansson, A.; Joshi, S. Encapsulation of Electron Beam Melting Produced Alloy 718 to Reduce Surface Connected Defects by Hot Isostatic Pressing. Materials 2020, 13, 1226. https://doi.org/10.3390/ma13051226
Zafer YE, Goel S, Ganvir A, Jansson A, Joshi S. Encapsulation of Electron Beam Melting Produced Alloy 718 to Reduce Surface Connected Defects by Hot Isostatic Pressing. Materials. 2020; 13(5):1226. https://doi.org/10.3390/ma13051226
Chicago/Turabian StyleZafer, Yunus Emre, Sneha Goel, Ashish Ganvir, Anton Jansson, and Shrikant Joshi. 2020. "Encapsulation of Electron Beam Melting Produced Alloy 718 to Reduce Surface Connected Defects by Hot Isostatic Pressing" Materials 13, no. 5: 1226. https://doi.org/10.3390/ma13051226
APA StyleZafer, Y. E., Goel, S., Ganvir, A., Jansson, A., & Joshi, S. (2020). Encapsulation of Electron Beam Melting Produced Alloy 718 to Reduce Surface Connected Defects by Hot Isostatic Pressing. Materials, 13(5), 1226. https://doi.org/10.3390/ma13051226