Makrygianni, M.; Zacharatos, F.; Andritsos, K.; Theodorakos, I.; Reppas, D.; Oikonomidis, N.; Spandonidis, C.; Zergioti, I.
Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. Materials 2021, 14, 3353.
https://doi.org/10.3390/ma14123353
AMA Style
Makrygianni M, Zacharatos F, Andritsos K, Theodorakos I, Reppas D, Oikonomidis N, Spandonidis C, Zergioti I.
Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. Materials. 2021; 14(12):3353.
https://doi.org/10.3390/ma14123353
Chicago/Turabian Style
Makrygianni, Marina, Filimon Zacharatos, Kostas Andritsos, Ioannis Theodorakos, Dimitris Reppas, Nikolaos Oikonomidis, Christos Spandonidis, and Ioanna Zergioti.
2021. "Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components" Materials 14, no. 12: 3353.
https://doi.org/10.3390/ma14123353
APA Style
Makrygianni, M., Zacharatos, F., Andritsos, K., Theodorakos, I., Reppas, D., Oikonomidis, N., Spandonidis, C., & Zergioti, I.
(2021). Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. Materials, 14(12), 3353.
https://doi.org/10.3390/ma14123353
