Analysis of Deformation and Stresses of a Lightweight Floor System (LFS) under Thermal Action
Abstract
:1. Introduction
- Thermal insulation with low thermal conductivity (wood-like boards, EPS, XPS, gypsum composites, and other similar materials);
- Heat-conducting layer (sheet, foil, lamellas);
- Heating pipes (coil) sunk in grooves of the thermal insulation;
- Artificial or natural flooring (ceramic tile, stone, wood, wood-like panels, PVC cladding, etc.) fixed with adhesives or laid loosely.
2. Materials and Experimental Methods
- U1—heat transfer coefficient in adhesives;
- U2—heat transfer coefficient in ceramic tiles;
- Tkl—adhesive temperature on the thermal insulation (reading from the sensor);
- Tpo—temperature on the ceramic tile;
- 1Gf—strain gauge on the tile, separated from the adhesive by a PVC foil;
- 2G—strain gauge on the tile, covered with glue;
- 3Kf—strain gauge on the adhesive, separated from the tile by a PVC foil;
- 4Xf—strain gauge on the XPS, separated from the adhesive by a PVC foil;
- 5X—strain gauge on the XPS, coated with adhesive;
- 6Kf—strain gauge on the adhesive (from the bottom of the mesh), separated from the XPS by foil;
- 7K—strain gauge on the adhesive, covered with adhesive, placed transversely to the coil (along the weft of the mesh);
- 8K—strain gauge on the adhesive, covered with adhesive, placed along the coil (along the warp of the mesh).
3. Results and Discussion of Experimental Methods
- -
- Thermal expansion of the component material used αC;
- -
- Thermal expansion of the strain gauge mesh material αM;
- -
- Temperature electrical resistance coefficient of the strain gauge material αR;
- -
- Temperature variation dT as an inducing variable.
- The standard deflection corresponded to 1/200 of the ceiling span (assumed to be 34 mm; Figure 29);
- The lightweight floor model with C2S1 adhesive was repeatedly duplicated up to a ceiling span of 6.00 m;
- The XPS insulation substrate was glued to the ceiling with cement glue;
- The reinforced concrete ceiling had a thickness of 20 cm;
- The joints were adopted as in the experimental model, and gaps between the XPS panels were also made;
- The adhesive and mesh separation model was used, and the mesh was modelled separately in PSS;
- The self-weight, the imposed load of 2 kN/m2, and the thermal action were all the same as in the experimental model.
- Thermal interaction with the floor self-weight, without the maximum standard deflection of the ceiling;
- Thermal action with the floor self-weight and imposed load together with the maximum standard deflection of the ceiling.
- The maximum compressive stress in the tiles was 25.5 < 240 MPa (tiles strength) and in the C2S1 adhesive was 9.87 < 15.3 MPa;
- The maximum vertical stress σy in the C2S1 adhesive, which connected the ceiling to the XPS thermal insulation, was 0.007 < 0.14 MPa (σymax—detachment strength).
4. Conclusions
- It was found that the measured values of deformation at the boundaries of the LFS system layers do not differ significantly from the results obtained from the numerical model. The differences amount to a maximum of 12.6% (see Table 2). In addition, the measured displacements at selected points of the model are consistent. Therefore, the correctness of the computational model and the correctness of the experimental research were confirmed. The computational model was simplified to the plane stress state (PSS). This simplification allowed for the use of less computing power while maintaining the appropriate accuracy.
- The concept of the computational model was adopted as a plane model with the use of two-dimensional finite elements working in the plane stress state (PSS). This was explained by the negligible friction between the floor composite and the substrate, which is related to the low weight of the lightweight floor and the lack of the imposed load. The test sample was lying freely on the substrate. This type of model solution is also indicated by the actual boundary conditions of the floor, where a expansion space is left between the floor and the walls, constituting the room boundaries, in order to possible thermal deformation. Hence, the adopted model is a justified simplification of the three-dimensional model (3D model).
- Based on the measured deformations, the internal forces in the form of stresses were calculated. These values were consistent with the calculation model, which confirmed the correctness of the adopted concept of converting strains into stresses. In the working conditions of the floor (i.e., with working loads—the temperature of the adhesive layer up to 35 °C and the self-weight), the strength of the LFS components was not exceeded.
- The computational model was also used for the computer simulation of the floor structure response under extreme operating conditions. The maximum allowable standard deflection of the ceiling was assumed to be l/200, and the floor to the ceiling was joined with type C2S1 adhesive. The results of the analysis showed that in the model without lamellas, the stresses in the cement joints in the middle of the floor may be exceeded, and their chipping may occur. It should be noted that the adopted maximum deflection value is overestimated, as the ceiling is already pre-bent before the floor is built in. The numerical calculations consciously did not take into account the aspect of the initial deflection caused by the self-weight of the structure before the floor layers were made.
- Based on the performed tests and analyses, it can be concluded that the presented LFS lightweight floor system without screeds can be safely used.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
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Adhesive /Tkl/Tw | Tpo | (Tpo − Ti) | (Tw − Ti) | (Tkl − Ti) | Research Time | Deformation after Correction (μm/m) | ||||
---|---|---|---|---|---|---|---|---|---|---|
(°C) | (°C) | (°C) | (°C) | (°C) | (s) | 1Gf | 3Kfg | 4Xf | 6Kfx | |
C2S1 | 24/23.8 | 23.5 | 0.5 | 0.8 | 1 | 500 | 10 | 5 | 31 | 8 |
25/24.8 | 24.7 | 1.7 | 1.8 | 2 | 700 | 21 | 14 | 54 | 20 | |
26/25.8 | 25.5 | 2.5 | 2.8 | 3 | 1200 | 23 | 17 | 80 | 25 | |
27/26.8 | 26.7 | 3.7 | 3.8 | 4 | 1500 | 30 | 34 | 87 | 40 | |
28/27.8 | 27.6 | 4.6 | 4.8 | 5 | 2250 | 39 | 37 | 94 | 46 | |
29/28.7 | 28.3 | 5.3 | 5.7 | 6 | 3200 | 47 | 44 | 96 | 58 | |
31/30.6 | 30.0 | 7.0 | 7.6 | 8 | 5500 | 54 | 59 | 114 | 70 | |
33/32.6 | 32.0 | 9.0 | 9.6 | 10 | 7000 | 95 | 83 | 115 | 97 | |
34/33.6 | 33.0 | 10.0 | 10.6 | 11 | 10,000 | 99 | 88 | 119 | 102 | |
34.5/34.1 | 33.6 | 10.6 | 11.1 | 11.5 | 11,500 | 107 | 93 | 124 | 116 | |
35/34.7 | 34.2 | 11.2 | 11.7 | 12 | 22,000 | 80 | 75 | 135 | 136 | |
35/34.7 | 34.3 | 11.3 | 11.7 | 12 | 38,250 | 73 | 30 | 140 | 141 |
Measurement Point | Computational Deformation O/A | Measured Deformation | Relative Deviation (%) | Comments |
---|---|---|---|---|
1Gf | +84.8 × 10−6/+91.4 × 10−6 | +97.0 × 10−6 | 12.6/ 5.8 | Strain gauge glued to the tile, separated from the adhesive |
3Kf | +88.8 × 10−6/+94.3 × 10−6 | +85.5 × 10−6 | 3.8/ 10.3 | Strain gauge glued to the adhesive, separated from the tile |
4Xf | +103.4 × 10−6/+121.0 × 10−6 | +117.0 × 10−6 | 11.6/ 3.4 | Strain gauge glued to the XPS, separated from the adhesive |
6Kf | +87.5 × 10−6/+94.9 × 10−6 | +99.5 × 10−6 | 12.1/ 4.6 | Strain gauge glued to the adhesive, separated from the XPS |
Layer | Stress in Sections (T/T + U) (MPa) | Strength (MPa) | Comments | |
---|---|---|---|---|
σx | σy///τ | |||
Tile/ C2S1 (I) | ⊖ 4.73/16.17 (I) ⊖ 8.79/19.91 (II) | ⊖ 1.48/2.76 (I) ⊖ 4.79/6.12 (III/V) //0.12/0.88 (V) | ⊖ 15.3 ⊖ 240 ⊕52.0 | Large stocks of load capacity in ceramic tile. Exceeding the strength of the adhesive in the joint, at σx (T + U) |
C2S1 | ⊖3.27/8.53 (I) | ⊖ 1.12/1.46 (II/I) //0.05/0.25 (V) | ⊖ 15.3 ⊕ 0.14 - σymax//0.4 | Large stocks of load capacity in adhesive |
GFRP (fiberglass mesh) | ⊖ 8.99/18.08 (V) ⊕ 2.72/⊖ 9.2 (II) | - | ⊖ (-) ⊕ 1350 | Large stocks of load capacity in the mesh. No compression failure, marked by (-) |
XPS | ⊖ 0.026/ 0.028 (V) | ⊖ 0.017/0.021 (V/IV) //0.003/0.013 (IV) | ⊖ 0.30 ⊕ 0.40//0.15 | Large stocks of load capacity in XPS |
C2S1 | ⊕ 0.037/0.13 (I–V) | ⊖ 0.005/0.013 (I) //0.004/0.024 (III) | ⊖ 15.3 ⊕ 1.35 //0.4 | Large stocks of load capacity in connection with the ceiling |
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Karpiesiuk, J.; Chyży, T. Analysis of Deformation and Stresses of a Lightweight Floor System (LFS) under Thermal Action. Materials 2021, 14, 5727. https://doi.org/10.3390/ma14195727
Karpiesiuk J, Chyży T. Analysis of Deformation and Stresses of a Lightweight Floor System (LFS) under Thermal Action. Materials. 2021; 14(19):5727. https://doi.org/10.3390/ma14195727
Chicago/Turabian StyleKarpiesiuk, Jacek, and Tadeusz Chyży. 2021. "Analysis of Deformation and Stresses of a Lightweight Floor System (LFS) under Thermal Action" Materials 14, no. 19: 5727. https://doi.org/10.3390/ma14195727
APA StyleKarpiesiuk, J., & Chyży, T. (2021). Analysis of Deformation and Stresses of a Lightweight Floor System (LFS) under Thermal Action. Materials, 14(19), 5727. https://doi.org/10.3390/ma14195727