Roduan, S.F.; Wahab, J.A.; Salleh, M.A.A.M.; Mahayuddin, N.A.H.M.; Abdullah, M.M.A.B.; Halil, A.B.M.; Zaifuddin, A.Q.S.; Muhammad, M.I.; Sandu, A.V.; Baltatu, M.S.;
et al. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. Materials 2023, 16, 96.
https://doi.org/10.3390/ma16010096
AMA Style
Roduan SF, Wahab JA, Salleh MAAM, Mahayuddin NAHM, Abdullah MMAB, Halil ABM, Zaifuddin AQS, Muhammad MI, Sandu AV, Baltatu MS,
et al. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. Materials. 2023; 16(1):96.
https://doi.org/10.3390/ma16010096
Chicago/Turabian Style
Roduan, Siti Faqihah, Juyana A. Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu,
and et al. 2023. "Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy" Materials 16, no. 1: 96.
https://doi.org/10.3390/ma16010096
APA Style
Roduan, S. F., Wahab, J. A., Salleh, M. A. A. M., Mahayuddin, N. A. H. M., Abdullah, M. M. A. B., Halil, A. B. M., Zaifuddin, A. Q. S., Muhammad, M. I., Sandu, A. V., Baltatu, M. S., & Vizureanu, P.
(2023). Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. Materials, 16(1), 96.
https://doi.org/10.3390/ma16010096
