Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications
1
School of Intelligent Manufacturing, Nanjing University of Science and Technology, Nanjing 210094, China
2
School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
*
Author to whom correspondence should be addressed.
Materials 2023, 16(17), 5975; https://doi.org/10.3390/ma16175975
Submission received: 28 August 2023
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Accepted: 28 August 2023
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Published: 31 August 2023
(This article belongs to the Special Issue Advances in 3D Printed Reinforced Materials/Electronics: Processes, Properties and Applications)
The current Special Issue entitled “Advances in 3D printed electronics: materials, processes, properties and applications” aims to discuss the latest developments in the field of the AM of structures or components with reinforcements [1] or conductive elements [2].
Additive manufacturing (AM) shows prominent advantages in the modern industry owing to the almost unlimited design freedom it provides to produce components with complex 3D shapes without the need for tooling [3,4]. In order to fabricate structures or components for real-world applications with high performances or multiple functions, reinforcements or conductive elements are introduced in the latest AM techniques. The methodology and mechanism of multi-functional AM are meaningful to its further development.
The topics addressed in this Special Issue include new computational models and approaches to predicting the fabrication processes and mechanical properties of complex structures and components and new additive manufacturing technologies that cover various types of material extrusion, material lamination, binder jetting, ink writing [5], selective laser sintering [6], curing and sintering, etc. New composite systems containing either fiber reinforcements or conductive elements are covered. The applications of the AM of integrated structures in other fields, e.g., the design of robots and bio-inspired structures, are also welcome.
Funding
This work was supported by the National Natural Science Foundation of China.
Conflicts of Interest
The authors declare no conflict of interest.
References
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- Tang, H.; Chen, H.; Sun, Q.; Chen, Z.; Yan, W. Experimental and computational analysis of structure-property relationship in carbon fiber reinforced polymer composites fabricated by selective laser sintering. Compos. Part B Eng. 2021, 204, 108499. [Google Scholar] [CrossRef]
Short Biography of Authors
Haibin Tang graduated with a degree in Flight Vehicle Propulsion Engineering from the Nanjing University of Aeronautics and Astronautics in 2012, and he received his PhD in Mechanical Engineering from the Nanjing University of Aeronautics and Astronautics in 2019. From 2019 to 2021, he worked at the National University of Singapore as a research fellow. In 2021, he joined the Nanjing University of Science and Technology as an associate professor.
Xingzhi Xiao graduated from the Nanjing University of Science and Technology in 2012, and he received his PhD from the School of Mechanical Engineering at the Nanjing University of Science and Technology in 2018. He is currently an associate professor at the Nanjing University of Science and Technology.
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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
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MDPI and ACS Style
Tang, H.; Xiao, X. Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications. Materials 2023, 16, 5975. https://doi.org/10.3390/ma16175975
AMA Style
Tang H, Xiao X. Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications. Materials. 2023; 16(17):5975. https://doi.org/10.3390/ma16175975
Chicago/Turabian StyleTang, Haibin, and Xingzhi Xiao. 2023. "Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications" Materials 16, no. 17: 5975. https://doi.org/10.3390/ma16175975
APA StyleTang, H., & Xiao, X. (2023). Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications. Materials, 16(17), 5975. https://doi.org/10.3390/ma16175975
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