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Journal: Micromachines, 2021
Volume: 12
Number: 480

Article: Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures
Authors: by Zhenhua Wu, Shuai Zhang, Zekun Liu, Cheng Lu and Zhiyu Hu
Link: https://www.mdpi.com/2072-666X/12/5/480

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