Stencel, L.C.; Strogies, J.; Müller, B.; Knofe, R.; Borwieck, C.; Heimann, M.
Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration. Micromachines 2023, 14, 1885.
https://doi.org/10.3390/mi14101885
AMA Style
Stencel LC, Strogies J, Müller B, Knofe R, Borwieck C, Heimann M.
Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration. Micromachines. 2023; 14(10):1885.
https://doi.org/10.3390/mi14101885
Chicago/Turabian Style
Stencel, Lisa Christin, Jörg Strogies, Bernd Müller, Rüdiger Knofe, Carsten Borwieck, and Matthias Heimann.
2023. "Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration" Micromachines 14, no. 10: 1885.
https://doi.org/10.3390/mi14101885
APA Style
Stencel, L. C., Strogies, J., Müller, B., Knofe, R., Borwieck, C., & Heimann, M.
(2023). Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration. Micromachines, 14(10), 1885.
https://doi.org/10.3390/mi14101885