Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes
Abstract
:1. Introduction
2. Theoretical Analyses
2.1. The Effect Mechanism of Gas Leakage
2.2. Degradation Models Based on Gas Leakage
3. Experimental Results
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Xu, Y.; Liu, S.; He, C.; Wu, H.; Cheng, L.; Huang, Q.; Yan, G. Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines 2023, 14, 1956. https://doi.org/10.3390/mi14101956
Xu Y, Liu S, He C, Wu H, Cheng L, Huang Q, Yan G. Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines. 2023; 14(10):1956. https://doi.org/10.3390/mi14101956
Chicago/Turabian StyleXu, Yingyu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang, and Guizhen Yan. 2023. "Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes" Micromachines 14, no. 10: 1956. https://doi.org/10.3390/mi14101956
APA StyleXu, Y., Liu, S., He, C., Wu, H., Cheng, L., Huang, Q., & Yan, G. (2023). Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines, 14(10), 1956. https://doi.org/10.3390/mi14101956