Xu, Y.; Liu, S.; He, C.; Wu, H.; Cheng, L.; Huang, Q.; Yan, G.
Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines 2023, 14, 1956.
https://doi.org/10.3390/mi14101956
AMA Style
Xu Y, Liu S, He C, Wu H, Cheng L, Huang Q, Yan G.
Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines. 2023; 14(10):1956.
https://doi.org/10.3390/mi14101956
Chicago/Turabian Style
Xu, Yingyu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang, and Guizhen Yan.
2023. "Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes" Micromachines 14, no. 10: 1956.
https://doi.org/10.3390/mi14101956
APA Style
Xu, Y., Liu, S., He, C., Wu, H., Cheng, L., Huang, Q., & Yan, G.
(2023). Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes. Micromachines, 14(10), 1956.
https://doi.org/10.3390/mi14101956
