Dai, Y.; Yao, J.; Chen, J.; Qian, Q.; Zhang, M.; Zhang, J.; Yao, Q.; Huang, C.; Sun, M.; Guo, Y.
A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels. Micromachines 2024, 15, 1336.
https://doi.org/10.3390/mi15111336
AMA Style
Dai Y, Yao J, Chen J, Qian Q, Zhang M, Zhang J, Yao Q, Huang C, Sun M, Guo Y.
A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels. Micromachines. 2024; 15(11):1336.
https://doi.org/10.3390/mi15111336
Chicago/Turabian Style
Dai, Yuxuan, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun, and Yufeng Guo.
2024. "A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels" Micromachines 15, no. 11: 1336.
https://doi.org/10.3390/mi15111336
APA Style
Dai, Y., Yao, J., Chen, J., Qian, Q., Zhang, M., Zhang, J., Yao, Q., Huang, C., Sun, M., & Guo, Y.
(2024). A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels. Micromachines, 15(11), 1336.
https://doi.org/10.3390/mi15111336
