Order Article Reprints

Dai Y, Yao J, Chen J, Qian Q, Zhang M, Zhang J, Yao Q, Huang C, Sun M, Guo Y. A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels. Micromachines. 2024; 15(11):1336. https://doi.org/10.3390/mi15111336

Dai, Yuxuan, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun, and Yufeng Guo. 2024. "A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels" Micromachines 15, no. 11: 1336. https://doi.org/10.3390/mi15111336

Dai, Y., Yao, J., Chen, J., Qian, Q., Zhang, M., Zhang, J., Yao, Q., Huang, C., Sun, M., & Guo, Y. (2024). A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels. Micromachines, 15(11), 1336. https://doi.org/10.3390/mi15111336