Koh, D.; Wang, A.; Schneider, P.; Bosinski, B.; Oh, K.W.
Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS. Micromachines 2017, 8, 280.
https://doi.org/10.3390/mi8090280
AMA Style
Koh D, Wang A, Schneider P, Bosinski B, Oh KW.
Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS. Micromachines. 2017; 8(9):280.
https://doi.org/10.3390/mi8090280
Chicago/Turabian Style
Koh, Domin, Anyang Wang, Phil Schneider, Brett Bosinski, and Kwang W. Oh.
2017. "Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS" Micromachines 8, no. 9: 280.
https://doi.org/10.3390/mi8090280
APA Style
Koh, D., Wang, A., Schneider, P., Bosinski, B., & Oh, K. W.
(2017). Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS. Micromachines, 8(9), 280.
https://doi.org/10.3390/mi8090280