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Journal: Polymers, 2019
Volume: 11
Number: 597

Article: Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride
Authors: by Van-Dung Mai, Dae-Il Lee, Jun-Hong Park and Dai-Soo Lee
Link: https://www.mdpi.com/2073-4360/11/4/597

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