He, S.; Chi, C.; Peng, C.; Zeng, B.; Chen, Y.; Miao, Z.; Xu, H.; Luo, W.; Chen, G.; Fu, Z.;
et al. A Novel P/N/Si-Containing Vanillin-Based Compound for a Flame-Retardant, Tough Yet Strong Epoxy Thermoset. Polymers 2023, 15, 2384.
https://doi.org/10.3390/polym15102384
AMA Style
He S, Chi C, Peng C, Zeng B, Chen Y, Miao Z, Xu H, Luo W, Chen G, Fu Z,
et al. A Novel P/N/Si-Containing Vanillin-Based Compound for a Flame-Retardant, Tough Yet Strong Epoxy Thermoset. Polymers. 2023; 15(10):2384.
https://doi.org/10.3390/polym15102384
Chicago/Turabian Style
He, Siyuan, Cheng Chi, Chaohua Peng, Birong Zeng, Yongming Chen, Zhongxi Miao, Hui Xu, Weiang Luo, Guorong Chen, Zhenping Fu,
and et al. 2023. "A Novel P/N/Si-Containing Vanillin-Based Compound for a Flame-Retardant, Tough Yet Strong Epoxy Thermoset" Polymers 15, no. 10: 2384.
https://doi.org/10.3390/polym15102384
APA Style
He, S., Chi, C., Peng, C., Zeng, B., Chen, Y., Miao, Z., Xu, H., Luo, W., Chen, G., Fu, Z., & Dai, L.
(2023). A Novel P/N/Si-Containing Vanillin-Based Compound for a Flame-Retardant, Tough Yet Strong Epoxy Thermoset. Polymers, 15(10), 2384.
https://doi.org/10.3390/polym15102384