Xiong, X.; Guan, H.; Li, B.; Yang, S.; Li, W.; Ren, R.; Wang, J.; Chen, P.
Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins. Polymers 2024, 16, 1149.
https://doi.org/10.3390/polym16081149
AMA Style
Xiong X, Guan H, Li B, Yang S, Li W, Ren R, Wang J, Chen P.
Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins. Polymers. 2024; 16(8):1149.
https://doi.org/10.3390/polym16081149
Chicago/Turabian Style
Xiong, Xuhai, Hongyu Guan, Baiyu Li, Shuai Yang, Wenqiang Li, Rong Ren, Jing Wang, and Ping Chen.
2024. "Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins" Polymers 16, no. 8: 1149.
https://doi.org/10.3390/polym16081149
APA Style
Xiong, X., Guan, H., Li, B., Yang, S., Li, W., Ren, R., Wang, J., & Chen, P.
(2024). Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins. Polymers, 16(8), 1149.
https://doi.org/10.3390/polym16081149