Sharma, A.; Oh, M.C.; Chae, M.J.; Seo, H.; Ahn, B.
Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling. Metals 2020, 10, 370.
https://doi.org/10.3390/met10030370
AMA Style
Sharma A, Oh MC, Chae MJ, Seo H, Ahn B.
Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling. Metals. 2020; 10(3):370.
https://doi.org/10.3390/met10030370
Chicago/Turabian Style
Sharma, Ashutosh, Min Chul Oh, Myoung Jin Chae, Hyungtak Seo, and Byungmin Ahn.
2020. "Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling" Metals 10, no. 3: 370.
https://doi.org/10.3390/met10030370
APA Style
Sharma, A., Oh, M. C., Chae, M. J., Seo, H., & Ahn, B.
(2020). Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling. Metals, 10(3), 370.
https://doi.org/10.3390/met10030370