Sun, J.; Liang, H.; Sun, S.; Hu, J.; Teng, C.; Zhao, L.; Bai, H.
Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy. Metals 2022, 12, 1640.
https://doi.org/10.3390/met12101640
AMA Style
Sun J, Liang H, Sun S, Hu J, Teng C, Zhao L, Bai H.
Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy. Metals. 2022; 12(10):1640.
https://doi.org/10.3390/met12101640
Chicago/Turabian Style
Sun, Jia, Huaxin Liang, Shaofu Sun, Juntao Hu, Chunyu Teng, Lingyan Zhao, and Hailong Bai.
2022. "Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy" Metals 12, no. 10: 1640.
https://doi.org/10.3390/met12101640
APA Style
Sun, J., Liang, H., Sun, S., Hu, J., Teng, C., Zhao, L., & Bai, H.
(2022). Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy. Metals, 12(10), 1640.
https://doi.org/10.3390/met12101640