Ma, K.; Cheng, Y.; Jeyaprakash, N.; Zhou, J.; Wan, Y.; Yang, W.
Temperature Gradient and Solidification Rate Simulation Model of the Microstructure of Laser-Cladded 27SiMn. Metals 2023, 13, 1682.
https://doi.org/10.3390/met13101682
AMA Style
Ma K, Cheng Y, Jeyaprakash N, Zhou J, Wan Y, Yang W.
Temperature Gradient and Solidification Rate Simulation Model of the Microstructure of Laser-Cladded 27SiMn. Metals. 2023; 13(10):1682.
https://doi.org/10.3390/met13101682
Chicago/Turabian Style
Ma, Kun, Yanhai Cheng, Natarajan Jeyaprakash, Jiali Zhou, Yixing Wan, and Wenhui Yang.
2023. "Temperature Gradient and Solidification Rate Simulation Model of the Microstructure of Laser-Cladded 27SiMn" Metals 13, no. 10: 1682.
https://doi.org/10.3390/met13101682
APA Style
Ma, K., Cheng, Y., Jeyaprakash, N., Zhou, J., Wan, Y., & Yang, W.
(2023). Temperature Gradient and Solidification Rate Simulation Model of the Microstructure of Laser-Cladded 27SiMn. Metals, 13(10), 1682.
https://doi.org/10.3390/met13101682