Lima, T.S.; de Gouveia, G.L.; da Silva Septimio, R.; da Cruz, C.B.; Silva, B.L.; Brito, C.; Spinelli, J.E.; Cheung, N.
Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. Metals 2019, 9, 241.
https://doi.org/10.3390/met9020241
AMA Style
Lima TS, de Gouveia GL, da Silva Septimio R, da Cruz CB, Silva BL, Brito C, Spinelli JE, Cheung N.
Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. Metals. 2019; 9(2):241.
https://doi.org/10.3390/met9020241
Chicago/Turabian Style
Lima, Thiago Soares, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, José Eduardo Spinelli, and Noé Cheung.
2019. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses" Metals 9, no. 2: 241.
https://doi.org/10.3390/met9020241
APA Style
Lima, T. S., de Gouveia, G. L., da Silva Septimio, R., da Cruz, C. B., Silva, B. L., Brito, C., Spinelli, J. E., & Cheung, N.
(2019). Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. Metals, 9(2), 241.
https://doi.org/10.3390/met9020241