Schmid, M.; Bhogaraju, S.K.; Liu, E.; Elger, G.
Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Appl. Sci. 2020, 10, 8516.
https://doi.org/10.3390/app10238516
AMA Style
Schmid M, Bhogaraju SK, Liu E, Elger G.
Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Applied Sciences. 2020; 10(23):8516.
https://doi.org/10.3390/app10238516
Chicago/Turabian Style
Schmid, Maximilian, Sri Krishna Bhogaraju, E Liu, and Gordon Elger.
2020. "Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics" Applied Sciences 10, no. 23: 8516.
https://doi.org/10.3390/app10238516
APA Style
Schmid, M., Bhogaraju, S. K., Liu, E., & Elger, G.
(2020). Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Applied Sciences, 10(23), 8516.
https://doi.org/10.3390/app10238516