Wang, J.; Duan, F.; Lv, Z.; Chen, S.; Yang, X.; Chen, H.; Liu, J.
A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis. Appl. Sci. 2023, 13, 8301.
https://doi.org/10.3390/app13148301
AMA Style
Wang J, Duan F, Lv Z, Chen S, Yang X, Chen H, Liu J.
A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis. Applied Sciences. 2023; 13(14):8301.
https://doi.org/10.3390/app13148301
Chicago/Turabian Style
Wang, Jintao, Fangcheng Duan, Ziwen Lv, Si Chen, Xiaofeng Yang, Hongtao Chen, and Jiahao Liu.
2023. "A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis" Applied Sciences 13, no. 14: 8301.
https://doi.org/10.3390/app13148301
APA Style
Wang, J., Duan, F., Lv, Z., Chen, S., Yang, X., Chen, H., & Liu, J.
(2023). A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis. Applied Sciences, 13(14), 8301.
https://doi.org/10.3390/app13148301