Article Versions Notes

Carroll L, Lee J-S, Scarcella C, Gradkowski K, Duperron M, Lu H, Zhao Y, Eason C, Morrissey P, Rensing M, et al. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Applied Sciences. 2016; 6(12):426. https://doi.org/10.3390/app6120426

Carroll, Lee, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, and et al. 2016. "Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices" Applied Sciences 6, no. 12: 426. https://doi.org/10.3390/app6120426

Carroll, L., Lee, J. -S., Scarcella, C., Gradkowski, K., Duperron, M., Lu, H., Zhao, Y., Eason, C., Morrissey, P., Rensing, M., Collins, S., Hwang, H. Y., & O’Brien, P. (2016). Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Applied Sciences, 6(12), 426. https://doi.org/10.3390/app6120426