Next Article in Journal
InP-Based Foundry PICs for Optical Interconnects
Next Article in Special Issue
Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application
Previous Article in Journal
Industrial Cyber-Physical System Evolution Detection and Alert Generation
 
 
Article

Article Versions Notes

Appl. Sci. 2019, 9(8), 1587; https://doi.org/10.3390/app9081587
Action Date Notes Link
article xml file uploaded 17 April 2019 09:49 CEST Original file -
article xml uploaded. 17 April 2019 09:49 CEST Update https://www.mdpi.com/2076-3417/9/8/1587/xml
article pdf uploaded. 17 April 2019 09:49 CEST Version of Record https://www.mdpi.com/2076-3417/9/8/1587/pdf
article supplementary file uploaded. 17 April 2019 09:49 CEST - https://www.mdpi.com/2076-3417/9/8/1587#supplementary
article html file updated 17 April 2019 09:50 CEST Original file -
article html file updated 25 April 2019 10:36 CEST Update -
article html file updated 8 May 2019 13:11 CEST Update -
article html file updated 18 October 2019 11:41 CEST Update -
article html file updated 12 February 2020 05:50 CET Update -
article html file updated 19 July 2022 17:37 CEST Update https://www.mdpi.com/2076-3417/9/8/1587/html
Back to TopTop