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Journal: Nanomaterials, 2019
Volume: 9
Number: 1742

Article: Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects
Authors: by Kodai Kishibe, Soichiro Hirata, Ryoichi Inoue, Tatsushi Yamashita and Katsuaki Tanabe
Link: https://www.mdpi.com/2079-4991/9/12/1742

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