A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers
Abstract
:1. Introduction
- Higher system efficiency due to lower switching and conduction losses, because the wider bandgap of SiC (compared to Si) implies smaller leakage currents
- A higher temperature operating range, which implies reduced cooling requirements (e.g., heat sink size); the SiC material thermal conductivity is three times larger than the one found for Si. Moreover, the thermal conductivity of 4H-SiC is higher than that of copper at room temperature, while additionally, its junction temperature can reach values up to 600 °C [1,16]. However, commercial SiC MOSFETs are still rated at 175 °C due to packaging and reliability limitations.
- A higher switching frequency capability, due to the possibility to reduce the required chip area of SiC around 65 times compared to that of the equivalent Si version for the same current levels. Consequently, a much smaller device parasitic capacitance can be provided [17], which yields achieving faster operation speeds (much higher dv/dt and di/dt), thus enabling a dramatic increase in the switching frequency (up to megahertz power converters are foreseen)
- Transient features of the power device, such as the turn-on, ton, and turn-off, toff, switching intervals, as well as the rise and fall time intervals, tr and tf, respectively, which are much faster than in the case of standard drivers for Si devices. Additionally, the propagation delays with increased switching frequency need to be considered in SiC-based power converters [20]. As a main requirement, the gate voltage of the SiC MOSFET must have a fast dv/dt to achieve fast switching times. This indicates that a very low impedance driver is necessary [28,29]. For instance, if an optocoupler is used, it must provide a high common mode transient immunity (CMTI) [29].
- Static features of the SiC MOSFET, such as the drain-to-source on-resistance, RDSon, that determines the gate-to-source voltage, vGSon, when the device is turned on.
- The required driving voltage levels for the power MOSFET; in case of an SiC driver, the most suitable values are defined as [20]:
- The total gate charge of the power device. This parameter is significantly lower in the case of SiC MOSFET.
- The parasitic capacitances of the power device. Some complexity is imposed by the turn-on and off events due to several nonlinear parasitic capacitances that affect the process. These capacitances depend on the operating conditions of the device. Moreover, these values are coupled with the conditions at the gate drive [17]. Therefore, the study of the switching waveforms in SiC is critical for understanding the requirements for the gate driver, particularly for very fast drivers [17]. However, the measurement and characterization of these components, specifically the SiC MOSFET capacitances, is not straightforward in most cases [30,31,32].
- Implementation and hardware design of the gate driver. These aspects determine key parameters such as the gate resistor, the parasitic inductances (dictated by the gate driver layout and connection to the gate terminals of the SiC MOSFET), which can cause false turn-on and turn-off instants during switching transitions, and increase switching losses and shoot-through related failures in the converter [33,34]. On this basis, a complete analysis of current-controlled and voltage-controlled drivers for SiC MOSFETs is presented in [3]. In particular, the trends for the gate driver and the protection circuitry are to integrate these features into a single-chip solution. In this case, the major challenges arise due to the resulting high di/dt and dv/dt. Additionally, the noise susceptibility is a critical issue in polluted electromagnetic (EM) environments [1]. The driver must be designed considering the relatively low parasitic values of inductance and capacitance that arise from the packaging conditions in SiC devices. This parasitic reduction requires that driving and sensing circuits must be as close as possible to the WBG switching devices. Some solutions propose such levels of integration [35,36].
2. Analysis of the Technical Literature in the State of the Art
2.1. Resistance of the Driver, RG
2.2. Parasitic Capacitances
2.3. Parasitic Gate Loop Inductor
2.4. Isolation Requeriments
2.5. Derivative of Voltages and Currents, dv/dt and di/dt
2.6. Tolerances
2.7. Packaging
3. Description of the Driver Based on the Impulse Transformer
4. Main Characteristics of the Impulse Transformer
4.1. Implementation of the Working Principle
4.2. Characterization of the Impulse Transformer
4.3. Generation of the Output Votage Levels
4.4. Implementation of the Reconstructing Stage
4.5. Circuit Modeling and Simulation Results
5. Experimental Validation of the Driver Based on the Impulse Transformer
5.1. Experimental Characterization of the Working Principle
5.2. Validation in a Laboratory Converter
5.3. Discussion and Conclusions of the Implementation of the Driver Based on the Impulse Transformer
6. Description of the Modulated Transformer
7. Main Characteristics of the Modulated Transformer
7.1. Implementation of the Working Principle
7.2. Implementation of the Oscillator and Modulator Stage
7.3. Characterization of the Transformers
7.4. Circuit Modeling and Simulation Results
8. Experimental Validation of the Modulated Driver
Experimental Characterization of the Working Principle
9. Description of the Bilevel Amplitude-Modulated Driver
10. Main Characteristics of the Bilevel AM Driver
10.1. Implementation of the Working Principle
10.2. Synchronization Block
10.3. Characterization of the Transformers
10.4. Circuit Modeling and Simulation Results
11. Experimental Validation of the Modulated Driver
11.1. Experimental Characterization of the Working Principle
11.2. Validation in a Laboratory Converter
11.3. Main Conslusions and Discussion on the Bilevel AM Driver
12. Comparison of Results for the Three Solutions Investigated
12.1. Main Operational Features
12.2. Additional Electrical Features
12.3. Implementation Aspects
13. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Gate Driver Description | Refs. from Literature |
---|---|
Optocoupler based for other SiC/GaN devices (JFET, BJT) | [103,104,105,106,107,108] |
Optocoupler based for SiC MOSFET (conventional) | [104,109,110,111,112,113,114,115,116,117,118,119,120] |
Optocoupler based for SiC MOSFET (resonant) | [121,122] |
PCB transformer-isolated | [107,123] |
Ferrite transformer-isolated | [124,125,126,127,128] |
Edge-triggered transformer-isolated method | [129,130] |
Modulation based method (no 0% duty in SiC) | [131,132] |
On/Off pulse-based method | [130,133,134] |
Part Description | Part Reference |
---|---|
NPN BJTs in the complementary power stage | ZXTN25040DFH |
PNP BJTs in the complementary power stage | ZXTP25040DFH |
Signal MOSFETs transistors at the flip-flop | FDS3812 |
Operational amplifier | OPA2810 |
Diode rectifiers (secondary side) | PMEG6030EP |
Transformer core | TX16/9.6/6.3 3E5 |
Target SiC power MOSFET | C2M0080120D |
Part Reference | Parameter | Symbol | Value |
---|---|---|---|
ZXTN25040DFH | Collector-to-Emitter saturation voltage | vCE | 0.2 V |
ZXTN25040DFH | Base-to-Emitter bias voltage | vBE | 0.7 V |
ZXTP25040DFH | Collector-to-Emitter saturation voltage | vCE | 0.2 V |
ZXTP25040DFH | Base-to-Emitter bias voltage | vBE | 0.7 V |
LM6172 | Output voltage drop (vO − vOH) | vRail | 0.2 V |
PMEG6030EP | Forward voltage drop in diodes | vF | 0.53 V |
Parameter | Symbol | Value |
---|---|---|
Rated output power | Pnom | 2 kW |
Switching frequency | fSW | 200 kHz |
Output current value | Io | 5 A |
Output voltage value | Vo | 400 V |
Input current value | IIN | 5 A |
Input voltage value | VIN | 400 V |
SiC power MOSFET switches | - | C2M0080120D |
Parameter | Symbol | Value |
---|---|---|
Primary side turns | Npri | 5 |
Secondary side turns | Nsec | 22 |
Core material | - | 3E5 |
Core dimensions | Øext/Øint/Width | 16/9.6/6.3 mm |
Turns-ratio | rt | 4.1 |
Magnetizing inductance at the primary side | Lµ | 181 µH |
Magnetizing inductor at the secondary side | L′µ | 3.16 mH |
Leakage inductance at the primary side | Ld | 1.03 µH |
Leakage inductance at the primary side | L′d | 19.4 µH |
Series resistance at the primary side | Rs | 0.022 Ω |
Series resistance at the secondary side | Rs | 0.433 Ω |
Coupling capacitor (primary to secondary side) | Cc | 3.41 pF |
Parameter | Symbol | Value |
---|---|---|
Output power value | PO | 1.8 kW |
Switching frequency | fSW | 100 kHz |
Output current value | Io | 5 A |
Output voltage value | Vo | 360 V |
Input current value | IIN | 4.7 A |
Input voltage value | VIN | 400 V |
Part Description | Part Reference |
---|---|
NPN BJTs in the complementary power stage | ZXTN25040DFH |
PNP BJTs in the complementary power stage | ZXTP25040DFH |
Signal MOSFETS transistors at the flip-flop | FDS3812 |
Operational amplifier | LM7171 |
Diode rectifiers (secondary side) | PMEG6030EP |
Transformer core | TX10/6/4, 3E5 |
Target SiC power MOSFET | C2M0080120D |
Parameter | Symbol | Value (Signal Transformer) | Value (Power Transformer) |
---|---|---|---|
Primary side turns | Npri | 10 | 10 |
Secondary side turns | Nsec | 10 | 25 |
Core material | - | 3E5 | 3E5 |
Core dimensions | Øext/Øint/Width | 10/6/4 mm | 10/6/4 mm |
Turns-ratio | rt | 1 | 2 |
Magnetizing inductance at the primary side | Lμ | 400 µH | 400 µH |
Magnetizing inductor at the secondary side | L′μ | 400 µH | 2500 µH |
Leakage inductance at the primary side | Ld | 0.5 µH | 0.54 µH |
Leakage inductance at the primary side | L′d | 0.5 µH | 2.7 µH |
Series resistance at the primary side | Rs | 0.12 Ω | 0.1 Ω |
Series resistance at the secondary side | R′s | 0.12 Ω | 0.4 Ω |
Coupling Capacitor (primary to secondary side) | Cc | 3.0 pF | 3.0 pF |
Parameter | Symbol | Value |
---|---|---|
Primary side turns | Npri | 10 |
Secondary side turns | Nsec | 22 |
Core material | - | 3 × 105 |
Core dimensions | Øext/Øint/Width | 10/6/4 mm |
Turns-ratio | rt | 2.2 |
Magnetizing inductance at the primary side | Lμ | 440 µH |
Magnetizing inductor at the secondary side | L′μ | 1700 µH |
Leakage inductance at the primary side | Ld | 0.25 µH |
Leakage inductance at the primary side | L′d | 1.7 µH |
Series resistance at the primary side | Rs | 0.054 Ω |
Series resistance at the secondary side | R′s | 0.33 Ω |
Coupling capacitor (primary to secondary side) | Cc | 2.13 pF |
Parameter | Impulse TRANSFORMER Scheme | On/Off Modulation Scheme | Bilevel AM Scheme | Standard Scheme (Opto + Ext. Source) |
---|---|---|---|---|
Isolation | Magnetic (1 transformer) | Magnetic (2 transformers) | Magnetic (1 transformer) | Optical and Magnetic |
Possible integration in power module | yes | yes | yes | Not directly |
Relative achievable power density | highest | moderate | very high | low |
Component count | 1 transformer + 2 ICs + 46 simple parts | 2 transformers + 6 ICs + 52 simple parts | 1 transformer + 5 ICs + 40 simple parts | - |
PWM range | 10–90% | Full | full | Full |
Switching frequency | 50–230 kHz | DC—200 kHz | DC—200 kHz | DC—several MHz |
Switching speed at turn on, vDS | 25 V/ns | 25 V/ns | 26.7 V/ns | - |
Switching speed at turn off, vDS | 21 V/ns | 21 V/ns | 20 V/ns | - |
Power consumption (fSW = 100 kHz, d = 50%) | 2.3 W | 3.0 W | 2.6 W | 2 W |
Coupling capacitance (primary to secondary side) | 3.41 pF | 6 pF | 2.13 pF | 1–2 pF (requires power source) |
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Garcia, J.; Saeed, S.; Gurpinar, E.; Castellazzi, A. A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers. Electronics 2021, 10, 159. https://doi.org/10.3390/electronics10020159
Garcia J, Saeed S, Gurpinar E, Castellazzi A. A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers. Electronics. 2021; 10(2):159. https://doi.org/10.3390/electronics10020159
Chicago/Turabian StyleGarcia, Jorge, Sarah Saeed, Emre Gurpinar, and Alberto Castellazzi. 2021. "A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers" Electronics 10, no. 2: 159. https://doi.org/10.3390/electronics10020159
APA StyleGarcia, J., Saeed, S., Gurpinar, E., & Castellazzi, A. (2021). A Study of Integrated Signal and Power Transfer for Compact Isolated SiC MOSFET Gate-Drivers. Electronics, 10(2), 159. https://doi.org/10.3390/electronics10020159