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Electronics
Volume 13
Issue 10
10.3390/electronics13101818
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Journal: Electronics, 2024
Volume: 13
Number: 1818

Article: Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration
Authors: by Tzu-Jung Huang, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon and Ivan Puchades
Link: https://www.mdpi.com/2079-9292/13/10/1818

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