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Journal: Electronics, 2024
Volume: 13
Number: 2173

Article: Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications
Authors: by Byungwoo Kim, Gyeongyeong Cheon, Yong-Ho Ko and Yoonchul Sohn
Link: https://www.mdpi.com/2079-9292/13/11/2173

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