Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems
Abstract
:1. Introduction
2. System Components
2.1. Basic Idea
2.2. Main System Modules
- The substrate moving module delivers the web at a controlled speed.
- The pattern detection module captures the positions of the alignment and the Print/Go marks.
- The ink-jet printing module retrieves and prints patterns with the desired material.
- The curing system provides in-line fast curing of the ink.
- The system control module processes images from the image acquisition module, and controls the ink-jet printing module.
2.3. Web Tracking Module
2.4. Pattern Detection Module
2.5. Material Ink-Jet Printing Module
2.6. Photonic Curing System
2.7. System Control Module
3. System Integration
3.1. Alignment Strategy in the Y Direction (Lateral Direction)
3.2. Alignment Strategy in the X Direction (Web Moving Direction)
3.3. Software Development Using NI LabVIEW
4. Module Testing
4.1. Alignment Mark Detection
4.2. Registration for Multi-Layer Printing
5. Performance Overview
- The resolution of the printhead.
- The time required to initialize the Print Server software.
- The time between the print command being sent and the Print Server being ready to start printing.
- Image acquisition and processing delays.
- The number of PMBs or printheads which can be connected to a single PC.
- The operating system setup.
- The PC hardware.
- The other software or operations running on the PC.
- The Print Server configuration.
X Direction (absolute value) | |
---|---|
Limiting factors | Offset introduced |
Encoder error due to slip when start/stop | 100–200 μm |
Printer delay (4 ms delay, web running is 5m/min) | 333 μm during 4 ms |
Image file transfer delay (uncertain) | Estimate ≈ 500 μm (500 KB file size) (*) |
LabVIEW program image processing time (1 ms) | 80 μm |
Actual tested offset | <100 μm |
Y Direction (absolute vale) | |
Limiting factors | Offset introduced |
Printer nozzle offset | 70.5 μm |
Sideway wander offset while transferring from FOV to printhead | Up to 2000 μm |
Camera resolution | 3 μm |
Actual tested offset | <200 μm |
6. Conclusions
Acknowledgments
Author Contributions
Conflicts of Interest
References
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Lin, X.; Subbaraman, H.; Pan, Z.; Hosseini, A.; Longe, C.; Kubena, K.; Schleicher, P.; Foster, P.; Brickey, S.; Chen, R.T. Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems. Electronics 2014, 3, 624-635. https://doi.org/10.3390/electronics3040624
Lin X, Subbaraman H, Pan Z, Hosseini A, Longe C, Kubena K, Schleicher P, Foster P, Brickey S, Chen RT. Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems. Electronics. 2014; 3(4):624-635. https://doi.org/10.3390/electronics3040624
Chicago/Turabian StyleLin, Xiaohui, Harish Subbaraman, Zeyu Pan, Amir Hosseini, Chris Longe, Klay Kubena, Paul Schleicher, Phillip Foster, Sean Brickey, and Ray T. Chen. 2014. "Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems" Electronics 3, no. 4: 624-635. https://doi.org/10.3390/electronics3040624
APA StyleLin, X., Subbaraman, H., Pan, Z., Hosseini, A., Longe, C., Kubena, K., Schleicher, P., Foster, P., Brickey, S., & Chen, R. T. (2014). Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems. Electronics, 3(4), 624-635. https://doi.org/10.3390/electronics3040624