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Electronics
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Flexible Electronics
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Flexible Electronics

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".

Deadline for manuscript submissions: closed (30 May 2015) | Viewed by 76157

Special Issue Editors

Prof. Dr. Manuel Quevedo

E-Mail Website
Guest Editor
Department of Material Science and Engineering, University of Texas at Dallas, Richardson, TX 75080, USA
Interests: flexible electronics; radiation sensors; TFTs
Dr. Harish Subbaraman

E-Mail
Co-Guest Editor
Omega Optics, Inc., 8500 Shoal Creek Blvd, Austin, TX 78757, USA
Interests: flexible electronics; R2R ink-jet printing; phased-array antennas; flexible photonics; silicon photonics; optical interconnects

Special Issue Information

Dear Colleagues,

This Special Issue covers both organic and inorganic materials and devices for flexible electronics. Papers in the areas of materials synthesis, characterization, and modeling, along with device fabrication and testing, are requested. Areas of interest include organic and inorganic semiconductors (n-type or p-type), memory devices, sensors, and functional devices. Papers demonstrating novel applications, including display, large-area sensors, functional devices, RFID tags, smart medical sensors, fabric, and paper-based devices will be considered. Novel, large area processing methods, such as ink-jet processing, spray pyrolysis, solution deposition, and roll-to-roll processing, are also of interest.

Dr. Manuel Quevedo
Dr. Harish Subbaraman
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible electronics
  • large area sensors
  • novel materials and devices
  • large area processing

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Published Papers (6 papers)

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Research

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5267 KiB  
Article
Electrical Reliability of a Film-Type Connection during Bending
by Ryosuke Mitsui, Junya Sato, Seiya Takahashi and Shin-ichiro Nakajima
Electronics 2015, 4(4), 827-846; https://doi.org/10.3390/electronics4040827 - 26 Oct 2015
Cited by 4 | Viewed by 7937
Abstract
With the escalating demands for downsizing and functionalizing mobile electronics, flexible electronics have become an important aspect of future technologies. To address limitations concerning junction deformation, we developed a new connection method using a film-type connector that is less than 0.1 mm thick. [...] Read more.
With the escalating demands for downsizing and functionalizing mobile electronics, flexible electronics have become an important aspect of future technologies. To address limitations concerning junction deformation, we developed a new connection method using a film-type connector that is less than 0.1 mm thick. The film-type connector is composed of an organic film substrate, a UV-curable adhesive that deforms elastically under pressure, and electrodes that are arranged on the adhesive. The film-type connection relies on a plate-to-plate contact, which ensures a sufficient contact area. The electrical reliability of the film-type connection was investigated based on changes in the resistance during bending at curvature radii of 70, 50, 25, 10, 5, and 2.5 mm. The connection was bent 1000 times to investigate the reproducibility of the connector’s bending properties. The tests showed that no disconnections occurred due to bending in the vertical direction of the electrode, but disconnections were observed due to bending in the parallel direction at curvature radii of 10, 5, and 2.5 mm. In addition, the maximum average change in resistance was less than 70 milliohms unless a disconnection was generated. These results support the application of the new film-type connection in future flexible devices. Full article
(This article belongs to the Special Issue Flexible Electronics)
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1433 KiB  
Article
Piezoelectric Polymer-Based Collision Detection Sensor for Robotic Applications
by J. Michael Wooten, David M. Bevly and John Y. Hung
Electronics 2015, 4(1), 204-220; https://doi.org/10.3390/electronics4010204 - 12 Mar 2015
Cited by 6 | Viewed by 7072
Abstract
The authors present a large area collision detection sensor utilizing the piezoelectric effect of polyvinylidene fluoride film. The proposed sensor system provides high dynamic range for touch sensation, as well as robust adaptability to achieve collision detection on complex-shaped surfaces. The design allows [...] Read more.
The authors present a large area collision detection sensor utilizing the piezoelectric effect of polyvinylidene fluoride film. The proposed sensor system provides high dynamic range for touch sensation, as well as robust adaptability to achieve collision detection on complex-shaped surfaces. The design allows for cohabitation of humans and robots in cooperative environments that require advanced and robust collision detection systems. Data presented in the paper are from sensors successfully retrofitted onto an existing commercial robotic manipulator. Full article
(This article belongs to the Special Issue Flexible Electronics)
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581 KiB  
Article
Improving Performance and Versatility of Systems Based on Single-Frequency DFT Detectors Such as AD5933
by Leonid Matsiev
Electronics 2015, 4(1), 1-34; https://doi.org/10.3390/electronics4010001 - 31 Dec 2014
Cited by 12 | Viewed by 8681
Abstract
Turning grand concepts such as the Internet of Things (IoT) and Smart Cities into reality requires the development and deployment of a wide variety of computing devices incorporated into the Internet infrastructure. Unsupervised sensing is the cornerstone capability that these devices must have [...] Read more.
Turning grand concepts such as the Internet of Things (IoT) and Smart Cities into reality requires the development and deployment of a wide variety of computing devices incorporated into the Internet infrastructure. Unsupervised sensing is the cornerstone capability that these devices must have to perform useful functions, while also having low cost of acquisition and ownership, little energy consumption and a small footprint. Impedimetric sensing systems based on the so-called single-frequency DFT detectors possess many of these desirable attributes and are often introduced in remote monitoring and wearable devices. This study presents new methods of improving performance of such detectors. It demonstrates that the main source of systematic errors is the discontinuous test phasor causing the crosstalk between the in-phase and quadrature outputs and the leakage of the input signal. The study derives expressions for these errors as a function of the number of samples and operating frequency, and provides methods for correction. The proposed methods are applied to the operation of a practical device—a network analyzer integrated circuit AD5933—and discussed in detail. These methods achieve complete elimination of leakage errors and expansion of the low limit of the operation frequency range by nearly two decades without additional hardware. Full article
(This article belongs to the Special Issue Flexible Electronics)
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2258 KiB  
Article
Towards Realizing High-Throughput, Roll-to-Roll Manufacturing of Flexible Electronic Systems
by Xiaohui Lin, Harish Subbaraman, Zeyu Pan, Amir Hosseini, Chris Longe, Klay Kubena, Paul Schleicher, Phillip Foster, Sean Brickey and Ray T. Chen
Electronics 2014, 3(4), 624-635; https://doi.org/10.3390/electronics3040624 - 14 Nov 2014
Cited by 26 | Viewed by 10308
Abstract
High-rate roll-to-roll (R2R) tracker systems are utilized for large volume flexible electronic device manufacturing, and the current alignment mechanism between layers is mainly achieved by relying on passive techniques. In this paper, we present a machine vision based alignment strategy that is used [...] Read more.
High-rate roll-to-roll (R2R) tracker systems are utilized for large volume flexible electronic device manufacturing, and the current alignment mechanism between layers is mainly achieved by relying on passive techniques. In this paper, we present a machine vision based alignment strategy that is used to achieve precise registration for stacking multilayers. Based on this strategy, we demonstrate two-layer printing with alignment accuracy better than 100 μm in web moving direction and 200 μm in lateral direction at a web rate of 5 m/min. Full article
(This article belongs to the Special Issue Flexible Electronics)
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Review

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3649 KiB  
Review
Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors
by Fábio F. Vidor, Thorsten Meyers and Ulrich Hilleringmann
Electronics 2015, 4(3), 480-506; https://doi.org/10.3390/electronics4030480 - 24 Jul 2015
Cited by 51 | Viewed by 14676
Abstract
Flexible and transparent electronics have been studied intensively during the last few decades. The technique establishes the possibility of fabricating innovative products, from flexible displays to radio-frequency identification tags. Typically, large-area polymeric substrates such as polypropylene (PP) or polyethylene terephthalate (PET) are used, [...] Read more.
Flexible and transparent electronics have been studied intensively during the last few decades. The technique establishes the possibility of fabricating innovative products, from flexible displays to radio-frequency identification tags. Typically, large-area polymeric substrates such as polypropylene (PP) or polyethylene terephthalate (PET) are used, which produces new requirements for the integration processes. A key element for flexible and transparent electronics is the thin-film transistor (TFT), as it is responsible for the driving current in memory cells, digital circuits or organic light-emitting devices (OLEDs). In this paper, we discuss some fundamental concepts of TFT technology. Additionally, we present a comparison between the use of the semiconducting organic small-molecule pentacene and inorganic nanoparticle semiconductors in order to integrate TFTs suitable for flexible electronics. Moreover, a technique for integration with a submicron resolution suitable for glass and foil substrates is presented. Full article
(This article belongs to the Special Issue Flexible Electronics)
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4488 KiB  
Review
Review on Physically Flexible Nonvolatile Memory for Internet of Everything Electronics
by Mohamed T. Ghoneim and Muhammad M. Hussain
Electronics 2015, 4(3), 424-479; https://doi.org/10.3390/electronics4030424 - 23 Jul 2015
Cited by 121 | Viewed by 25951
Abstract
Solid-state memory is an essential component of the digital age. With advancements in healthcare technology and the Internet of Things (IoT), the demand for ultra-dense, ultra-low-power memory is increasing. In this review, we present a comprehensive perspective on the most notable approaches to [...] Read more.
Solid-state memory is an essential component of the digital age. With advancements in healthcare technology and the Internet of Things (IoT), the demand for ultra-dense, ultra-low-power memory is increasing. In this review, we present a comprehensive perspective on the most notable approaches to the fabrication of physically flexible memory devices. With the future goal of replacing traditional mechanical hard disks with solid-state storage devices, a fully flexible electronic system will need two basic devices: transistors and nonvolatile memory. Transistors are used for logic operations and gating memory arrays, while nonvolatile memory (NVM) devices are required for storing information in the main memory and cache storage. Since the highest density of transistors and storage structures is manifested in memories, the focus of this review is flexible NVM. Flexible NVM components are discussed in terms of their functionality, performance metrics, and reliability aspects, all of which are critical components for NVM technology to be part of mainstream consumer electronics, IoT, and advanced healthcare devices. Finally, flexible NVMs are benchmarked and future prospects are provided. Full article
(This article belongs to the Special Issue Flexible Electronics)
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